Effect of Warpage on Solder Joint Fatigue Life by Influencing the Solder Joint Shape in BGA Packages
Abstract: Warpage occurring during surface-mount assembly reflow processes may lead to severe solder bump reliability problems. In this research, a finite-element simulation analysis of the effect of ...
Abstract: Axial-flux (AF) permanent-magnet (PM) (AFPM) machine is a competent candidate for electric propulsion applications owing to its high power density, high efficiency and effective volume ...
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